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AG TermoPasty
AG Thermopad, thermally conductive tapes are used if the application of a thermal paste is not possible. The tapes are extremely flexible. Their high compressib..
Sodium persulfate B327, a compound for etching of printed circuit boards and pickling of copper. An ideal alternative to ferric chloride. It is readily soluble ..
This preparation is specifically designed to regenerate potentiometers, effectively removing all impurities and incorporating a special lubricant to ensure prop..
Paste with added silver compounds has a thermal conductivity of 3.8W/mK and is designed to operate within a temperature range of -30 degrees Celsius to 300 degr..
These flexible components are utilized in areas where paste application isn't feasible. Known for their high compressibility, they snugly fit elements requiring..
They are utilized in situations where the application of paste is not feasible. Known for their exceptional flexibility, they exhibit high compressibility, enab..
With an exceptional 45% gold content, this thermal paste boasts a remarkable thermal conductivity that is three times higher than standard thermal pastes. With ..
AG Thermopad, thermally conductive tapes are used if the application of a thermal paste is not possible. The tapes are extremely flexible. Their high compressib..
The substance minimizes friction between metal components, ensuring long-lasting protection against washing and abrasion...
Thermal conductive paste H facilitates the flow of heat between electronic components and the heat sink...
Medium-active rosin flux that achieves optimal wetting on copper (Cu) and lead-tin (PbSn) surfaces. It eliminates the need for washing after application...
They are employed in scenarios where paste application is impractical. Highly flexible, they boast high compressibility, ensuring an excellent fit for component..
Etching agent for printed circuit boards and copper. An ideal alternative to iron chloride. The agent dissolves very quickly and does not crystallize from the s..
This medium-active flux facilitates soldering of copper elements, silver-plated, zinc-plated, and nickel-plated surfaces. It is primarily used in applications w..
The product ensures good calling quality, protecting the sharpness of contours. The preparation is free of NaOH, which significantly increases work safety...
Paste with added silver compounds exhibits a thermal conductivity of 3.8W/mK and can withstand temperatures ranging from -30 degrees Celsius to 300 degrees Cels..
The product is utilized to safeguard electrical contacts and lubricate bearings, functioning effectively within a temperature range of up to 30°C...
Thermal paste H is designed to improve heat transfer between electronic components and the radiator.Specifications:Manufacturer: AG TermoPastyWeight: 5g..
5.20€
4.00€