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AG TermoPasty
Thermal paste H is designed to improve heat transfer between electronic components and the radiator.Specifications:Manufacturer: AG TermoPastyWeight: 5g..
Perfect for all processors, chipsets, GPUs and other components. It is characterized by good thermal conductivity parameters thanks to the use of diamond dust...
Optimal AG Extreme performance enables excellent heat conduction between components such as the CPU, GPU, LEDs, heat dissipation fin plates and the fan. Simple..
